RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch package
RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated 1Mb Flash memory 24 GPIOs in QFN40 and 0.4mm pin pitch package
RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals 12 GPIOs in WL-CSP34 and 0.4mm ball pitch package
RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package
RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package
RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch package
RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 32 GPIOs in QFN48 and 0.4mm pin pitch package