Dialog Semiconductor 产品线

DA14580-01AT1

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch package

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DA14580-01AT2

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch package

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DA14580-01A31

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 32 GPIOs in QFN48 and 0.4mm pin pitch package

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DA14580-01UNA

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals 12 GPIOs in WL-CSP34 and 0.4mm ball pitch package

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DA14583-01F01AT2

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated 1Mb Flash memory 24 GPIOs in QFN40 and 0.4mm pin pitch package

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DA14581-00AT1

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package

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DA14680-01F08A92

RF片上系统 - SoC BLE 4.2 Wearables SoC AQFN60 8Mb Flash

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DA14585-00000VV2

RF片上系统 - SoC BT5.0 WL-CSP34 SoC

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DA14681-01000A92

RF片上系统 - SoC BLE 4.2 Wearables SoC AQFN60

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DA14580-01A32

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 32 GPIOs in QFN48 and 0.4mm pin pitch package

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DA14581-00AT2

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package

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DA14583-01F01AT1

RF片上系统 - SoC Bluetooth Low Energy 4.2 SoC with integrated 1Mb Flash memory 24 GPIOs in QFN40 and 0.4mm pin pitch package

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